Intel Teased the DG1 at CES 2020, and now we might have some more details about Intel's efforts with graphics cards.
What you need to know
- Leaked documents show several graphics cards from Intel that utilize Intel's Foveros chip-stacking technology.
- One of the graphics cards could have a thermal design power of 500W.
- Intel first teased its DG1 discrete graphics card at CES 2020.
Intel could release a graphics card with an incredibly high thermal design power (TDP) of 500W, according to leaked documentation obtained by Digital Trends. The documents include a presentation from early 2019, so Intel could have changed its plans since the documents were created. If the devices listed in the document do come out, Intel could have a graphics card with the highest TDP on the market.
The documents obtained by Digital Trends include several graphics cards, all of which utilize Intel's Foveros chip-stacking technology. A chart from the documents shows seven graphics cards, including four listed as software development vehicle and three listed as reference validation platform. Intel's Xe DG1, which was shown discussed at CES 2020, is an SVD version and lines up with on of the careds on the chart. The chart also includes cards with two and four tiles.
As card designs increase their tile count, TDP increases as well. The one-card designs range from 75 to 150 watts while the two and four-tile designs have a TDP of 300W. For comparisson, the NVIDIA GeForce RTX 2080Ti has a TDP of 250.
It's important to note that while many powerful systems also have high TDP, that doesn't mean a graphics card with a TDP of 500 will be twice as powerful and fast as a system with a TDP of 250.
Digital Trends speculates that tiles in the graphics card would each have 128 execution units. That would mean a four-tile model would have 512 execution units in total.
Intel teased its discrete graphics cards at CES 2020 and the figures revealed today come from leaked documents from early last year, so we'll have to wait to see more details about Intel's upcoming line of graphics cards.
Intel Teased the DG1 at CES 2020, and now we might have some more details about Intel's efforts with graphics cards.
What you need to know
Leaked documents show several graphics cards from Intel that utilize Intel's Foveros chip-stacking technology.
One of the graphics cards could have a thermal design power of 500W.
Intel first teased its DG1 discrete graphics card at CES 2020.
Intel could release a graphics card with an incredibly high thermal design power (TDP) of 500W, according to leaked documentation obtained by Digital Trends. The documents include a presentation from early 2019, so Intel could have changed its plans since the documents were created. If the devices listed in the document do come out, Intel could have a graphics card with the highest TDP on the market.
The documents obtained by Digital Trends include several graphics cards, all of which utilize Intel's Foveros chip-stacking technology. A chart from the documents shows seven graphics cards, including four ... by: Sean Endicott via https://www.AiUpNow.com/
